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關于AMEC THERMASOL

							AMEC THERMASOL
						

AMEC Thermasol銷售各種熱管理材料。AMEC THERMASOL的產品包括導熱墊/絕緣體和間隙填充物，導熱膠帶，相變界面材料和石墨箔。

為您找到相關結果 45 條 21 /2

產品分類：

The MHP-2040A-250A is an ultra flat Heat Pipe to eliminate the need for a fan and heat sink, with the additional benefits of reducing power consumption, noise output and product thickness. It can directly remove heat from the source and be transferred direct to the chassis or to an external heat sink. It also negates the requirement for ventilation holes and thereby reduces ingress of dust (no air filters required) and static. . 40 to 170W Maximum heat transfer rate

最新賣價	包裝	應用	系列	電壓電源	工作溫度	封裝外殼

產品分類：

The W6TR315G-1.0GF is a 1mm Thermally Conductive Filler Pad extremely offers soft, 20 shore 00, yet maintains a high thermal conductivity of 3.15W/mK. It is the ideal material in situations where a great deal of heat needs to be conducted away from small electronic components. The extremely soft material allows it to adapt to different component shapes. Also the material offers low heat resistance, this particular property is reduced as the product"s thickness is decreased. As each new generation of electronics equipment exhibits higher performance and more and more power into ever smaller package sizes, it will dissipate power in the form of heat and requires some degree of thermal management. Thermasol markets a variety of thermal management materials in response to the changing needs of the assembly of electronics packaging in notebook computers, high-performance CPU, chipsets, mobile electronic appliances, power conversion and amplification modules etc. . 2.11g/cm3 Specific gravity . <1% Weight loss . 21.66psi Tensile strength . 410.38% Elongation . 1kV/mm Insulation strength . UL94V-0 Flammability rating . -40 to 200°C Operating temperature . One side fibre-glass reinforcement

最新賣價	包裝	應用	系列	電壓電源	工作溫度	封裝外殼

產品分類：

The MHP-2040A-100A is an ultra flat Heat Pipe to eliminate the need for a fan and heat sink, with the additional benefits of reducing power consumption, noise output and product thickness. It can directly remove heat from the source and be transferred direct to the chassis or to an external heat sink. It also negates the requirement for ventilation holes and thereby reduces ingress of dust (no air filters required) and static. . 40 to 170W Maximum heat transfer rate

最新賣價	包裝	應用	系列	電壓電源	工作溫度	封裝外殼

產品分類：

The MHP-2040A-400A is a 2 x 40 x 400mm groove ultra-flat Heat Pipe made of aluminium 1050 with acetone working fluid. This heat pipe may be possible to eliminate the need for a costly fan and heat sink, with the additional benefits of reducing power consumption, noise output, product thickness and cost. The flat heat pipes can directly remove heat from the source and be transferred direct to the chassis or to an external heat sink. It also negates the requirement for ventilation holes and thereby reduces ingress of dust (no air filters required) and static. . 0 to 90°C Operating inclination range . <0.3°C/W Typical thermal resistance . 40 to 170W Heat transfer rate

最新賣價	包裝	應用	系列	電壓電源	工作溫度	封裝外殼

產品分類：

The MHP-2550A-300A is an ultra flat Heat Pipe to eliminate the need for a fan and heat sink, with the additional benefits of reducing power consumption, noise output and product thickness. It can directly remove heat from the source and be transferred direct to the chassis or to an external heat sink. It also negates the requirement for ventilation holes and thereby reduces ingress of dust (no air filters required) and static. . 75 to 300W Maximum heat transfer rate

最新賣價	包裝	應用	系列	電壓電源	工作溫度	封裝外殼

W8TR500G-2.0-T1

產品分類：

The W8TR500G-2.0-T1 is a 2mm Thermally Conductive Filler Pad with an extremely high thermal conductivity 5.0W/mK, the highly soft 40 Shore 00, W8TR500G thermal conductive silicone pad is suitable for working environments where the temperature varies greatly. It is able to overcome virtually any adverse environment in addition to conducting heat away from electronic components. As each new generation of electronics equipment exhibits higher performance and more and more power into ever smaller package sizes, it will dissipate power in the form of heat and requires some degree of thermal management. Thermasol markets a variety of thermal management materials in response to the changing needs of the assembly of electronics packaging in notebook computers, high-performance CPU, chipsets, mobile electronic appliances, power conversion and amplification modules etc. . 2.4g/cm3 Specific gravity . <1% Weight loss . 18.51psi Tensile strength . 90.52% Elongation . 2kV/mm Insulation strength . UL94V-0 Flammability rating . -40 to 200°C Operating temperature

最新賣價	包裝	應用	系列	電壓電源	工作溫度	封裝外殼

W10TR600A-3.0-T1

產品分類：

The W10TR600A-3.0-T1 is a 3mm thermally conductive Silicone Filler Pad with extremely high thermal conductivity 6W/mK and medium softness 80 shores 00 with high tensile strength. It provides durability in harsh environments whilst conducting heat away from electronic components. As each new generation of electronics equipment exhibits higher performance and more and more power into ever smaller package sizes, it will dissipate power in the form of heat and requires some degree of thermal management. Thermasol markets a variety of thermal management materials in response to the changing needs of the assembly of electronics packaging in notebook computers, high-performance CPU, chipsets, mobile electronic appliances, power conversion and amplification modules etc. . 2.46g/cm3 Specific gravity . <1% Weight loss . 64psi Tensile strength . 99% Elongation . >10kV/mm Insulation strength . UL94V-0 Flammability rating . -40 to 200°C Operating temperature range . Adhesive tape fibre-glass side

最新賣價	包裝	應用	系列	電壓電源	工作溫度	封裝外殼

產品分類：

The W6TR315G-1.0 is a 1mm Thermally Conductive Filler Pad extremely offers soft, 20 shore 00, yet maintains a high thermal conductivity of 3.15W/mK. It is the ideal material in situations where a great deal of heat needs to be conducted away from small electronic components. The extremely soft material allows it to adapt to different component shapes. Also the material offers low heat resistance, this particular property is reduced as the product"s thickness is decreased. As each new generation of electronics equipment exhibits higher performance and more and more power into ever smaller package sizes, it will dissipate power in the form of heat and requires some degree of thermal management. Thermasol markets a variety of thermal management materials in response to the changing needs of the assembly of electronics packaging in notebook computers, high-performance CPU, chipsets, mobile electronic appliances, power conversion and amplification modules etc. . 2.11g/cm3 Specific gravity . <1% Weight loss . 21.66psi Tensile strength . 410.38% Elongation . 1kV/mm Insulation strength . UL94V-0 Flammability rating . -40 to 200°C Operating temperature

最新賣價	包裝	應用	系列	電壓電源	工作溫度	封裝外殼

產品分類：

The W6TR315G-2.0 is a 2mm Thermally Conductive Filler Pad extremely offers soft, 20 shore 00, yet maintains a high thermal conductivity of 3.15W/mK. It is the ideal material in situations where a great deal of heat needs to be conducted away from small electronic components. The extremely soft material allows it to adapt to different component shapes. Also the material offers low heat resistance, this particular property is reduced as the product"s thickness is decreased. As each new generation of electronics equipment exhibits higher performance and more and more power into ever smaller package sizes, it will dissipate power in the form of heat and requires some degree of thermal management. Thermasol markets a variety of thermal management materials in response to the changing needs of the assembly of electronics packaging in notebook computers, high-performance CPU, chipsets, mobile electronic appliances, power conversion and amplification modules etc. . 2.11g/cm3 Specific gravity . <1% Weight loss . 21.66psi Tensile strength . 410.38% Elongation . 1kV/mm Insulation strength . UL94V-0 Flammability rating . -40 to 200°C Operating temperature

最新賣價	包裝	應用	系列	電壓電源	工作溫度	封裝外殼

W8TR500G-5.0-T1

產品分類：

最新賣價	包裝	應用	系列	電壓電源	工作溫度	封裝外殼

產品分類：

最新賣價	包裝	應用	系列	電壓電源	工作溫度	封裝外殼

產品分類：

最新賣價	包裝	應用	系列	電壓電源	工作溫度	封裝外殼

產品分類：

The W8TR500G-0.5 is a 0.5mm Thermally Conductive Filler Pad with an extremely high thermal conductivity 5.0W/mK, the highly soft 40 Shore 00, W8TR500G thermal conductive silicone pad is suitable for working environments where the temperature varies greatly. It is able to overcome virtually any adverse environment in addition to conducting heat away from electronic components. As each new generation of electronics equipment exhibits higher performance and more and more power into ever smaller package sizes, it will dissipate power in the form of heat and requires some degree of thermal management. Thermasol markets a variety of thermal management materials in response to the changing needs of the assembly of electronics packaging in notebook computers, high-performance CPU, chipsets, mobile electronic appliances, power conversion and amplification modules etc. . 2.4g/cm3 Specific gravity . <1% Weight loss . 18.51psi Tensile strength . 90.52% Elongation . 2kV/mm Insulation strength . UL94V-0 Flammability rating . -40 to 200°C Operating temperature

最新賣價	包裝	應用	系列	電壓電源	工作溫度	封裝外殼

產品分類：

最新賣價	包裝	應用	系列	電壓電源	工作溫度	封裝外殼

產品分類：

最新賣價	包裝	應用	系列	電壓電源	工作溫度	封裝外殼

產品分類：

The W10TR600A-0.5 is a 0.5mm thermally conductive Silicone Filler Pad with extremely high thermal conductivity 6W/mK and medium softness 80 shores 00 with high tensile strength. It provides durability in harsh environments whilst conducting heat away from electronic components. As each new generation of electronics equipment exhibits higher performance and more and more power into ever smaller package sizes, it will dissipate power in the form of heat and requires some degree of thermal management. Thermasol markets a variety of thermal management materials in response to the changing needs of the assembly of electronics packaging in notebook computers, high-performance CPU, chipsets, mobile electronic appliances, power conversion and amplification modules etc. . 2.46g/cm3 Specific gravity . <1% Weight loss . 64psi Tensile strength . 99% Elongation . >10kV/mm Insulation strength . UL94V-0 Flammability rating . -40 to 200°C Operating temperature range

最新賣價	包裝	應用	系列	電壓電源	工作溫度	封裝外殼

W8TR500G-1.0-T1

產品分類：

最新賣價	包裝	應用	系列	電壓電源	工作溫度	封裝外殼

產品分類：

The W8TR500G-3.0 is a 3mm Thermally Conductive Filler Pad with an extremely high thermal conductivity 5.0W/mK, the highly soft 40 Shore 00, W8TR500G thermal conductive silicone pad is suitable for working environments where the temperature varies greatly. It is able to overcome virtually any adverse environment in addition to conducting heat away from electronic components. As each new generation of electronics equipment exhibits higher performance and more and more power into ever smaller package sizes, it will dissipate power in the form of heat and requires some degree of thermal management. Thermasol markets a variety of thermal management materials in response to the changing needs of the assembly of electronics packaging in notebook computers, high-performance CPU, chipsets, mobile electronic appliances, power conversion and amplification modules etc. . 2.4g/cm3 Specific gravity . <1% Weight loss . 18.51psi Tensile strength . 90.52% Elongation . 2kV/mm Insulation strength . UL94V-0 Flammability rating . -40 to 200°C Operating temperature

最新賣價	包裝	應用	系列	電壓電源	工作溫度	封裝外殼

產品分類：

最新賣價	包裝	應用	系列	電壓電源	工作溫度	封裝外殼

W8TR500G-1.0GF-TF

產品分類：

最新賣價	包裝	應用	系列	電壓電源	工作溫度	封裝外殼

W8TR500G-3.0GF-TF

產品分類：

最新賣價	包裝	應用	系列	電壓電源	工作溫度	封裝外殼

產品分類：

The W6TR315G-3.0 is a 3mm Thermally Conductive Filler Pad extremely offers soft, 20 shore 00, yet maintains a high thermal conductivity of 3.15W/mK. It is the ideal material in situations where a great deal of heat needs to be conducted away from small electronic components. The extremely soft material allows it to adapt to different component shapes. Also the material offers low heat resistance, this particular property is reduced as the product"s thickness is decreased. As each new generation of electronics equipment exhibits higher performance and more and more power into ever smaller package sizes, it will dissipate power in the form of heat and requires some degree of thermal management. Thermasol markets a variety of thermal management materials in response to the changing needs of the assembly of electronics packaging in notebook computers, high-performance CPU, chipsets, mobile electronic appliances, power conversion and amplification modules etc. . 2.11g/cm3 Specific gravity . <1% Weight loss . 21.66psi Tensile strength . 410.38% Elongation . 1kV/mm Insulation strength . UL94V-0 Flammability rating . -40 to 200°C Operating temperature

最新賣價	包裝	應用	系列	電壓電源	工作溫度	封裝外殼

產品分類：

The FCH micro porous ceramic finned heat sinks are constructed from entirely new material structure that moves heat by air circulation (without external force). Due to its micro-porous nature it provides a vast surface area compared with traditional heat sinks which ensures highly efficient heat dissipation. . Raised fins provides a greater surface area compared to flat type ceramic heat sinks . Power dissipation of up to 10W . Thermally conductive adhesive tape for direct IC surface mount . Non electrically conductive, no antennae effect . Not affected by humidity and dust . Light weight

最新賣價	包裝	應用	系列	電壓電源	工作溫度	封裝外殼

W8TR500G-2.0GF-TF

產品分類：

The W8TR500G-2.0GF-TF is a 2mm Thermally Conductive Filler Pad with an extremely high thermal conductivity 5.0W/mK, the highly soft 40 Shore 00, W8TR500G thermal conductive silicone pad is suitable for working environments where the temperature varies greatly. It is able to overcome virtually any adverse environment in addition to conducting heat away from electronic components. As each new generation of electronics equipment exhibits higher performance and more and more power into ever smaller package sizes, it will dissipate power in the form of heat and requires some degree of thermal management. Thermasol markets a variety of thermal management materials in response to the changing needs of the assembly of electronics packaging in notebook computers, high-performance CPU, chipsets, mobile electronic appliances, power conversion and amplification modules etc. . 2.4g/cm3 Specific gravity . <1% Weight loss . 18.51psi Tensile strength . 90.52% Elongation . 2kV/mm Insulation strength . UL94V-0 Flammability rating . -40 to 200°C Operating temperature

最新賣價	包裝	應用	系列	電壓電源	工作溫度	封裝外殼

W8TR500G-5.0GF-TF

產品分類：

最新賣價	包裝	應用	系列	電壓電源	工作溫度	封裝外殼

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