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自1876年成立以來，漢高旗下眾多品牌分別在個人消費及工業領域處于市場領先定位并享有美譽，比如寶瑩(Persil)、施華蔻(Schwarzkopf)、樂泰(Loctite)等。漢高Loctite?產品用于多種市場，例如電子、汽車、航空航天、機器制造和醫療設備以及多個通用工業領域。樂泰化工產品系列包括各種用于工業生產、工業維護以及汽車保養和維護的解決方案。漢高Loctite?生產線包括用于粘接接合處的潤滑劑、脫模劑、清潔劑和其他專用產品。

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* General purpose for stencil printing applications . Wide printing and reflow process windows (air and nitrogen) . Good tack performance, excellent slump resistance . No-clean residues . 90% metal content . IPC/J-STD ROLO approved

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* Standard 5-core solder combined with SAC387 lead-free alloy (96SC) . Ideal for repairing lead-free assemblies and for hand soldering, guaranteed total compatibility with SMT soldered joints . Regular and even flux distribution . Halogen-free . Translucent residues . Excellent wetting, increased flux content . Classification: J-STD ROL0

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A faster, more versatile pipe sealant which out-dates traditional tapes and hemp/pastes combinations. It therefore enables the improvements required of today"s pipe systems. Complies with all relevant standards. It instantly seals (irrespective of ambient temperature) domestic and industrial pipe systems during their assembly and can be safely used with drinking or waste water (hot and cold), gas, compressed air, and industrial oils. Can be used for metals and plastic threaded fittings . Potable water - WRC listed for use with potable water up to 85°C, meets BS 6920. . Gas and water - carries EN751-2 Class ARp, DVGW approval, together with DIN 30660

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最新賣價	包裝	應用	系列	電壓電源	工作溫度	封裝外殼

The 609973 is a no clean, clear residue cored Solder Wire designed to give fast and sustained wetting on both copper and brass. Multicore Crystal solid fluxes for cored solder wires have been specially formulated to complement No Clean wave and reflow soldering processes. It is also applicable to repair operations carried out after a cleaning process, eliminating the need for further cleaning. Multicore Crystal 400 is designed for users who require a halide-free formulation while Crystal 500 contains a low level of halide. The remaining products in the range contain higher halide levels to maximise soldering power. . Halide free version, Crystal 400 . Fast soldering, range of activities to suit all applications . Good spread on copper, brass and nickel . Clear residues . Heat stable, low spitting . Mild odour

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* Ideal for retaining close fitting cylindrical parts . For use on cylindrical fitting parts where thorough degreasing is not possible . Approved for use on bearings . WRC Approval (BS 6920): 0910511 . Diametrical clearance: Up to 0.1 mm . Tensile shear strength: 22.5 N/mm2 . Service temperature range: -55°C to +150°C . Fixture time on steel: 8 min . 10ml

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The 904545 is a 0.71mm 60/40 grade X52 N-clean Cored Solder Wire, made of Sn and Pb alloy. This X52 cored wire is manufactured as standard with a nominal flux content 1%. . Fast and sustained soldering on copper and brass . Non-corrosive . Negligible residues

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型號：

90ISC HF212 AGS 88,5 AF5 500G JAR

The 90ISC HF212 AGS 88,5 AF5 500G JAR is a Solder Paste available for stencil printing with Type 3 and Type 4 powder. LOCTITE HF 212 solder paste is a halogen-free (no intended added halogen in formulation), no clean, low voiding Pb-free solder paste. LOCTITE HF 212 also shows excellent solderability when reflowed in both air and nitrogen across a wide range of challenging surface finishes including immersion Ag, OSP-Cu, ENIG and CuNiZn. LOCTITE HF 212 is suitable for use with industry standard SAC, high reliability SAC and low silver alloys SAC. . Halogen-free flux, passes IC with pre-treatment IPC-TM-650 2.3.34/EN14582 . Halogen-free flux classification, ROL0 to ANSI/J-STD-004 Rev. B . Printing, fine pitch capability (0.3mm), stencil life (>8 hours) and abandon time (>4 hours) . Printing, Suitable for high speed printing up to 150mm/s . Reflow, solderable on challenging surface finishes (CuNiZn and Copper OSP) . Colourless residues for easy post-reflow inspection

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最新賣價	包裝	應用	系列	電壓電源	工作溫度	封裝外殼

The LOCTITE 595 series Superflex? clear RTV silicone Adhesive Sealant is a single component, room temperature vulcanizing compound designed to provide an excellent adhesive sealant for mechanical assemblies. This material cures on exposure to moisture in the air to form a tough, flexible, silicone rubber seal. The product resists aging, weathering and thermal cycling without hardening, shrinking or cracking. It is designed for superior bonding and sealing properties to most surfaces (not recommended for concrete). Formulated to withstand extreme temperature cycling, UV light and ozone. The Superflex? clear RTV silicone adhesive sealant cures on exposure to moisture in the air. The product dries tack free in two hours and fully cures in 24 hours. Cure times will vary with temperature, humidity and gap. It is suitable for electrical insulation, protects leads from mechanical shock, bonds trim, seals ductwork, vents, flues, doors and windows. . Non-slumping . Superior adhesion and flexibility . Seals out moisture and contaminants . Excellent adhesive properties . Fills large cracks and seams . Non-flammable and -toxic Not recommended for use in pure oxygen or oxygen rich systems and should not be selected as a sealant for chlorine or other strong oxidizing materials.

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最新賣價	包裝	應用	系列	電壓電源	工作溫度	封裝外殼

Kit for making replacement O-Rings on the spot. . The joint resists water and oil . Stronger than the rubber itself

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The 904557 is a no clean cored Solder Wire contains a careful balance of resins and activators to provide minimal residues, high activity and good reliability without cleaning. Multicore X52 low residue solid flux has been specially formulated to complement no clean wave and reflow soldering processes where extra activity is required. It is also applicable to repair operations following a cleaning process to eliminate the need for further cleaning. Multicore X52 cored wire is manufactured as standard with a nominal flux content of 1% and are available in alloys Sn60 and Sn62 conforming to J-STD-006 and EN 29453 or alloys conforming to similar national and international standards and 99C lead-free alloy. The optimum tip temperature and heat capacity required for a hand soldering process is a function of the design of the iron and the task. . Eliminates cost of cleaning . Fast and sustained soldering on copper and brass . Non-corrosive formulation . Negligible residues

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最新賣價	包裝	應用	系列	電壓電源	工作溫度	封裝外殼

The LOCTITE 4062 series Ethyl Cyanoacrylate Adhesive designed for bonding of plastics and elastomeric materials where very fast fixturing is required. The low viscosity is particularly suitable for bonding applications where controlled penetration of adhesive is required. Under normal conditions, the atmospheric moisture initiates the curing process. Although full functional strength is developed in a relatively short time, curing continues for at least 24-hour before full chemical/solvent resistance is developed. The rate of cure will depend on the bondline gap. Thin bond lines result in high cure speeds, increasing the bond gap will decrease the rate of cure. Where cure speed is unacceptably long due to large gaps, applying activator to the surface will improve cure speed. However, this can reduce ultimate strength of the bond and therefore testing is recommended to confirm effect. . Very low viscosity . Humidity cure Not recommended for use in pure oxygen or oxygen rich system and should not be selected as a sealant for chlorine or other strong oxidizing materials.

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The 5029525-M is a 0.5mm 99.3/0.7 grade Lead-free Solder Wire, made of Sn and Cu alloy. The cored wire is manufactured with a range of flux contents and although users will normally be using products with a nominal flux content of 3%, the superior performance of this product may allow a lower flux content to be specified. This will further improve residue appearance by reducing the quantity. . Halide-free version . Fast soldering - Range of activities to suit all applications . Good spread on copper, brass and nickel . Clear residues . Heat stable, low spitting

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Designed for the superior bonding and sealing properties to most surfaces. Resists weathering and thermal cycling without hardening, shrinking or cracking and is formulated to withstand extreme temperature cycling. . Clear thixotropic paste . Acetoxy Silicone . One part component, requires no mixing . Medium viscosity . Cures at room temperature vulcanising (RTV) . Suitable for potting, coating or sealing

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最新賣價	包裝	應用	系列	電壓電源	工作溫度	封裝外殼

最新賣價	包裝	應用	系列	電壓電源	工作溫度	封裝外殼

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